| 1975 |
Research lab is built, started with 3” wafers
|
| 1977 |
MAC 8 & MAC 4 Microprocessors fabricated —
transferred to production
|
| 1980 |
Converted to
4” wafers
First 32 bit microprocessor MAC 80 demonstrated (3.5 µm
design rules)
|
| 1981 |
32
bit microprocessor-MAC 32 developed (2.5 µm design
rules); twin tub CMOS;
first use of silicides (TaSi2) — transferred to production
H-Line GCA stepper installed
|
| 1984 |
First CMOS technology using n and p-type
poly gates demonstrated
|
| 1986
|
World's first 248nm DUV stepper built in Murray Hill;
first devices using cobalt silicide
|
| 1987 |
MUX/DEMUX developed
(0.75 µm NMOS); used in AT&T transmission systems
First MEMS devices fabricated |
| 1988 |
0.6
µm 64K SRAM fabricated, using CoSi2; SOI
CMOS using CoSi2
|
| 1992 |
First x-ray
stepper
|
| 1996 |
0.25µm
technology development, Chisel Cell flash device demonstrated
|
| 1997 |
60nm NMOS fabricated,
193nm microstepper (0.6 NA) delivered
|
| 1998 |
30
nm NMOS fabricated; first devices using 193 nm lithography
|
| 1999 |
Vertical Replacement
Gate successfully fabricated; SiGe epitaxial capability;
fabricated DSP with a strong phase-shift mask
|
| 2001 |
World’s
leading fab for optical MEMS devices (1296x1296 Optical
Cross Connect) at 200 mm wafer size
|
| 2002 |
The New Jersey
Nanotechnology Consortium, LLC, is formed as 501c3
|
| 2003 |
The NJNC becomes a
wholly owned subsidiary of Lucent Technologies
|
| 2006 |
The NJNC
becomes a wholly-owned subsidiary of Alcatel-Lucent
with the merger of Lucent Technologies and Alcatel on December 1
|
